Embedding of High Power RF Transistor Dies in PCB Laminate

Published in In the proceedings of 2022 52nd European Microwave Conference (EuMC), 2022

Recommended citation: Ioannis Peppas, Hiroaki Takahashi, Jim Yip, Erich Schlaffer, Helmut Paulitsch, Wolfgang Bösch"Embedding of High Power RF Transistor Dies in PCB Laminate." In the proceedings of 2022 52nd European Microwave Conference (EuMC), 2022. https://ieeexplore.ieee.org/document/9999955