A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss

Published in In the proceedings of 2023 53rd European Microwave Conference (EuMC), 2023

Recommended citation: Ziad Hatab, Hiroaki Takahashi, Ahmad Alterkawi, Michael Gadringer, Wolfgang Bösch"A Quasi-TEM Approach for Designing Microvias for PCB Layer Transition with Minimal Return Loss." In the proceedings of 2023 53rd European Microwave Conference (EuMC), 2023. https://ieeexplore.ieee.org/document/10290259